Samsung will reportedly have TSMC make the base die for Nvidia's custom HBM on 3nm
Nvidia asked Samsung, SK hynix and Micron to build NVHBM base dies at TSMC, the Seoul Economic Daily reported. Samsung shares rose 1.29% in 10 minutes on October 19, 2026.
- Samsung will reportedly use TSMC's 3nm process for the base die of Nvidia's custom NVHBM memory, its first HBM production work with TSMC.
- Nvidia asked Samsung, SK hynix and Micron to make NVHBM base dies on TSMC 3nm and core dies on 1c DRAM, the Seoul Economic Daily reported.
- SK hynix agreed to use TSMC for its HBM4 base die in April 2024; Samsung had kept the work in its own foundry.
Reaction by asset (real prices)
| Asset | 2m before | At release | +1m | +10m | +1m % | +10m % |
|---|---|---|---|---|---|---|
| 005930 | 213250.00 | 213250.00 | 213750.00 | 216000.00 | +0.23% | +1.29% |
Samsung Electronics will use TSMC's 3-nanometer process to make the base die for Nvidia's next custom high-bandwidth memory (HBM), the Seoul Economic Daily reported on Sunday, October 18, 2026, citing industry sources. It would be the first time Samsung has handed part of its HBM production to TSMC, its main rival in contract chipmaking. Neither company has confirmed the arrangement. Samsung shares rose 1.29% in the ten minutes after the story reached the MoveSurge news feed at 10:04:27 a.m. Seoul time on Monday, from 213,250 won to 216,000 won.

What the base die does in Nvidia's NVHBM
An HBM stack is a pile of DRAM chips, the core dies, sitting on a base die that links them to the processor. In NVHBM, Nvidia's custom version, the memory controller moves out of the GPU and into the base die, so the base die becomes a logic chip built to Nvidia's design. According to the report, Nvidia asked all three HBM makers, Samsung, SK hynix and Micron, to build NVHBM base dies on TSMC's 3nm process and to make the core dies on the sixth-generation 1c DRAM process. Different manufacturing methods at each supplier make it hard to deliver the same performance, and one shared process also cuts the work of testing each supplier's chips separately.
Samsung had kept the whole job in-house
Until now Samsung has made both the core dies and the base die itself, and has offered customers memory, foundry and packaging as one package. SK hynix took the other route in April 2024, when it signed a memorandum of understanding with TSMC to use TSMC's logic process for its HBM4 base die. In August 2026, Samsung's own 4nm foundry lines were reported fully booked through 2027, with HBM4 base dies and Nvidia orders driving the demand.
| Supplier | HBM4 base die | NVHBM base die, per the October 18 report |
|---|---|---|
| SK hynix | TSMC logic process, under an April 2024 agreement | TSMC 3nm, as Nvidia requested |
| Samsung | Samsung Foundry 4nm, in-house | TSMC 3nm |
| Micron | Not covered in these reports | TSMC 3nm, as Nvidia requested |
Samsung reportedly agreed to Nvidia's terms after an internal review. It plans to keep making standard HBM and custom memory for other customers in-house, and it is checking whether its own foundry could produce NVHBM base dies if Nvidia's demand exceeds what TSMC can supply. The report did not say which Nvidia products will use NVHBM, when production starts or how many chips are involved.
How the stock traded
The Korean report came out on Sunday, so the news was already public when the Seoul market opened at 9 a.m. on Monday. By the time the story reached the MoveSurge news feed, Samsung had been trading for an hour. One minute later the stock was up 0.23% at 213,750 won. Our reaction reading put it at 216,000 won, up 1.29%, ten minutes after the headline, and the one-minute bars in the chart show the same price at the eleven-minute mark. Other news may also have affected the price in that window.
Is Samsung using TSMC to make HBM for Nvidia?
According to an October 18, 2026 Seoul Economic Daily report, Samsung will use TSMC's 3nm process for the base die of Nvidia's custom NVHBM memory. The DRAM core dies stay with Samsung. Neither company has confirmed it.
What is NVHBM?
NVHBM is Nvidia's custom high-bandwidth memory. Its base die holds the memory controller, so it is a logic chip built to Nvidia's design, and Nvidia reportedly wants every supplier to make it on TSMC's 3nm process.
How did Samsung stock react to the TSMC report?
Samsung shares rose 1.29% to 216,000 won in the ten minutes after the report reached the MoveSurge news feed at 10:04:27 a.m. Seoul time on October 19, 2026. The Korean report had been public since Sunday.
Sources
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Samsung to Use TSMC for Base Die in Nvidia's Custom HBM
— Seoul Economic Daily
Samsung will use TSMC's 3nm process for NVHBM base dies; Nvidia asked Samsung, SK hynix and Micron for TSMC base dies and 1c DRAM core dies; Samsung keeps in-house production for standard HBM and other customers and is checking its own foundry as a backup.
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Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports
— The Star (Reuters)
Reuters summary of the report; first time Samsung works with TSMC at the HBM manufacturing stage; Samsung previously made core and base dies in-house.
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Samsung deal with TSMC for NVIDIA custom HBM isn't a defeat
— Sammy Fans
Independent report of the TSMC base-die arrangement and Samsung's retained in-house model.
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SK hynix partners with TSMC to strengthen HBM technological leadership
— TrendForce
SK hynix signed an agreement with TSMC in April 2024 to use TSMC's logic process for the HBM4 base die.
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SK Hynix, TSMC tie up to stay ahead of Samsung for HBM supremacy
— KED Global
The SK hynix-TSMC HBM alliance was aimed at staying ahead of Samsung.
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